Metal Can Transistor

Categories: Components

Sub Category: Semiconductor Devices

Material: Plastic

We manufacture Various types of To39, To3 products with different chip types. The Assembly line also has capability to do High current Hybrid Microcircuits requiring Heavy wire Bonding in high current application. We do Chip mounting and wire Bonding and encapsulation including Globe topping. We do module assembly using SMD components and leaded components, with testing as required by the customer.