COOL-GAPFILL™ DT and TT Series of GAP PAD

COOL-GAPFILL™ is yet another enhanced thermal gap-filling material that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase changing and non-silicone and thus will not contaminate components. One side remains dry but conformable for easy removal while the heatsinking or heat-spreading side is pressure sensitive to provide the optimum thermal interface with low thermal impedance and thermal resistance.